Utvidet returrett til 31. januar 2024

Testing of Interposer-Based 2.5D Integrated Circuits

Om Testing of Interposer-Based 2.5D Integrated Circuits

The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies.

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  • Språk:
  • Engelsk
  • ISBN:
  • 9783319854618
  • Bindende:
  • Paperback
  • Sider:
  • 182
  • Utgitt:
  • 9. mai 2018
  • Utgave:
  • 12017
  • Dimensjoner:
  • 155x235x0 mm.
  • Vekt:
  • 3051 g.
  • BLACK NOVEMBER
  Gratis frakt
Leveringstid: 2-4 uker
Forventet levering: 30. november 2024

Beskrivelse av Testing of Interposer-Based 2.5D Integrated Circuits

The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies.

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