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This document was prepared to assist industrial plant operating personnel in avoiding steam purity related problems.

This volume contains the edited versions of the technical presentations of the third international gathering of researchers interested in the applications of artificial neural networks, genetic algorithms, and fuzzy logic. The papers in this volume are grouped into five categories: artificial neural network architectures, pattern recognition, neuro-control, neuro-manufacturing, and neuro-engineering systems. Contents include: Theoretical Foundation for CMAC Technique, Embeddable Reconfigurable Neuroprocessors, Heave Compensation Via Neural Networks, Benchmarking Framework for Neuro Algorithms, Handwriting Recognition Using an Art Based Network, Neural Vector Quantization for Image Compression, Training Fuzzy Controller, Genetic Three-Dimensional Packer, and Geophysical Target Identification in Environmental Investigations.

The explosive growth in chip power dissipation, resulting from greater transistor density and electronic functionality, has spawned numerous studies of thermal control techniques for single chip packages and multichip modules. This book presents current information on: Air and liquid cooling; Extended surface arrays; and Heat sinks. In addition, it offers a critical review of recent technical and patent literature in electronics cooling. This text is of special value to program managers, technologist and packaging engineers in the electronics industry; and researchers in University and government laboratories.

Sponsored jointly by the American Society of Mechanical Engineers and International Material Management Society, this single source reference is designed to meet today's need for updated technical information on planning, installing and operating materials handling systems.